The new FLASH 611 resin is a cold mounting resin designed to improve the efficiency of metallographic preparation. With an ultra-fast cure time of less than 2 minutes and controlled exothermic reactions activated by UV light, it offers exceptional performance combined with unrivalled ease of use. Its impressive speed and reliability make FLASH 611 resin an essential choice for high-throughput laboratories and the most demanding workflows. Designed for versatility, it is suitable for a wide range of materials: metals, plastics, ceramics and composites.

As well as speed, its strengths include ease of use, absence of mixing minimise waste and bubbles. Futhermore, this resin is odorless.

The fluidity of this transparent mounting resin and its very low shrinkage ensure a maximum penetration ratio in cavities. It is ideal for microelectronics, optics and microsystem applications. Compatible for conventional scanning electron microscopy (SEM) examinations.

Mono-component resin easy to dose and manipulate (no loss). Polymerisation with low temperature rise in 20 minutes in the blue light device M.M.866 + 10 minutes for the surface varnish. With no disturbing odour, it is resistant to alcohol and acids.

Versatile, it is adapted to the majority of common materials for the fast mounting standard sample. It is possible to change the viscosity by modifying the proportion of the mixture: liquid + powder. Resistant to the principal acids used in laboratories.

Solvent free and CMR-free

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A perfectly transparent resin used for precision parts, notably those of the electrical or electronics industry. It renders the sample perfectly visible, which allows analysing precise points. It must be used with the pneumatic device M.M.808 to obtain an optimum transparency.

Solvent free and CMR-free

* Packaging related to transport restrictions

Cold setting resin for sample recovery. Mounting is a step in metallographic sample preparation which enables samples to be ground and polished more ergonomically. Embedding the sample in a resin is usually irreversible and recovering the sample (if necessary) after embedding proves almost impossible.

Resin 665 is a cold mounting resin that has the unique ability to dissolve in acetone. This ability is transformed into a sustainable functionality to recover metallographic specimens after mounting. After metallographic processing of costly materials such as noble metals, it is often important from an economic and technical perspective to recover the samples from the mounting resin.

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Multi-purpose resin with a limited exothermic temperature of 50°C* and a curing time of 10 hours.

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613F is a fast-curing epoxy resin, 2 to 3 hours. It should be used on materials that can withstand temperatures up to 140°C.

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613LT is an epoxy resin which cures without temperature rise. It is recommended in cases where samples would be degraded by heating during polymerization.

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The Resin 607 is a three-component resin based on modified polyester. This fast curing resin adheres perfectly to metal surfaces and its mechanical characteristics make it particularly effective on very hard materials. Its very low shrinkage allows edge examinations on metallographic samples. It is resistant to the main acids and bases used in laboratories.