The new ORGANIC 701 hot mounting resin completes our list of consumables for the preparation of metallographic samples.

In the dynamic field of materials science and metallography, developing environmentally-friendly solutions without compromising performance is a constant challenge. That’s why we have added ORGANIC 701 to our range.

This resin offers a range of benefits, including dust-free pellet form, sustainable raw materials from responsible sources, optimum hardness of 85 Shore D and low shrinkage. ORGANIC 701 is an excellent alternative to conventional phenolic or epoxy resins.

Phenol-free and formaldehyde-free thermosetting mounting resin

In line with its ecological commitment, LAM PLAN proposes on the market the first effective alternative to phenol metallographic mounting resins which are liable to release phenol (and/or formaldehyde) during baking.

The PHENOFREE mounting is intended for the technical mounting of all types of materials for material examinations or edge examinations. It smartly replaces the traditional phenol mounting resins with the same hardness and less shrinkage than a phenol mounting resins.

The range of PHENOFREE resins includes 3 coloured resins (grey, white and red) to make the identification of your metallographic samples easier. They are particularly adapted for the polishing of hard materials. The white Phenofree resin may prove to be in some cases a good alternative to the use of epoxy resins.

The black epoxy mounting resin is filled with glass fibres with high mineral loads. It is ideal for mountings intended for edge examinations of hard to extra hard materials thanks to its resistance to abrasion, important hardness and absence of shrinkage.

Conductive resin suitable for electrolytic polishing and SEM examination. Based on pure copper of very homogeneous consistency, the conductivity of your mounts is optimised. The use of ultra-pure materials eliminates the risk of analysis errors.